558-10-456M26-001104 - BGA SURFACE MOUNT 1.27MM
Produsentens varenummer
Intern delenummer
Produsent
Kort beskrivelse
BGA SURFACE MOUNT 1.27MM
RoHS Status
Blyfri / RoHS
Leveringstid
1-2 dager
tilgjengelig Antall
5120 Pieces
Reference Pris
Vår pris
- (Ta kontakt med oss for en bedre pris: [email protected])
- AX Semiconductor har 558-10-456M26-001104 på lager for selger.
- Frakt alternativer og shipping tid:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Betalingsalternativer:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
spesifikasjoner for 558-10-456M26-001104
Kvalitets garanti :
365 dagers garanti
Stock Resource :
Franchise distributør / produsent Direct
Opprinnelsesland :
USA / TAIWAN / MEXICO / MALAYSIA / PHI
Delenummer :
558-10-456M26-001104
Produsent :
Preci-Dip
Beskrivelse :
BGA SURFACE MOUNT 1.27MM
Serie :
558
Delstatus :
Active
Type :
BGA
Antall posisjoner eller pins (rutenett) :
456 (26 x 26)
Pitch - Parring :
0.050" (1.27mm)
Kontaktfinish - parring :
Gold
Kontaktfinish tykkelse - parring :
10.0µin (0.25µm)
Kontaktmateriale - parring :
Brass
Monteringstype :
Surface Mount
Egenskaper :
Closed Frame
Avslutning :
Solder
Pitch - Post :
0.050" (1.27mm)
Kontakt Finish - Post :
Gold
Kontakt ferdig tykkelse - post :
10.0µin (0.25µm)
Kontaktmateriell - Innlegg :
Brass
Husmateriell :
FR4 Epoxy Glass
Driftstemperatur :
-55°C ~ 125°C
Vekt :
-
Betingelse :
Nytt og originalt
Relaterte linker :
558-10 , 558-10-456
dokumenter for 558-10-456M26-001104
Dataark :
558-10-456M26-001104.pdf
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