558-10-357M19-001104 - BGA SURFACE MOUNT 1.27MM
Produsentens varenummer
Intern delenummer
Produsent
Kort beskrivelse
BGA SURFACE MOUNT 1.27MM
RoHS Status
Blyfri / RoHS
Leveringstid
1-2 dager
tilgjengelig Antall
6552 Pieces
Reference Pris
Vår pris
- (Ta kontakt med oss for en bedre pris: [email protected])
- AX Semiconductor har 558-10-357M19-001104 på lager for selger.
- Frakt alternativer og shipping tid:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Betalingsalternativer:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
spesifikasjoner for 558-10-357M19-001104
Kvalitets garanti : 365 dagers garanti
Stock Resource : Franchise distributør / produsent Direct
Opprinnelsesland : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Delenummer : 558-10-357M19-001104
Produsent : Preci-Dip
Beskrivelse : BGA SURFACE MOUNT 1.27MM
Serie : 558
Delstatus : Active
Type : BGA
Antall posisjoner eller pins (rutenett) : 357 (19 x 19)
Pitch - Parring : 0.050" (1.27mm)
Kontaktfinish - parring : Gold
Kontaktfinish tykkelse - parring : 10.0µin (0.25µm)
Kontaktmateriale - parring : Brass
Monteringstype : Surface Mount
Egenskaper : Closed Frame
Avslutning : Solder
Pitch - Post : 0.050" (1.27mm)
Kontakt Finish - Post : Gold
Kontakt ferdig tykkelse - post : 10.0µin (0.25µm)
Kontaktmateriell - Innlegg : Brass
Husmateriell : FR4 Epoxy Glass
Driftstemperatur : -55°C ~ 125°C
Vekt : -
Betingelse : Nytt og originalt
Relaterte linker : 558-10 , 558-10-357
dokumenter for 558-10-357M19-001104
Dataark : 558-10-357M19-001104.pdf
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