558-10-352M26-001104 - BGA SURFACE MOUNT 1.27MM

Produsentens varenummer
Intern delenummer
Produsent
Kort beskrivelse
BGA SURFACE MOUNT 1.27MM
RoHS Status
Blyfri / RoHS
Leveringstid
1-2 dager
tilgjengelig Antall
6640 Pieces
Reference Pris
USD 67.499598
Vår pris
- (Ta kontakt med oss ​​for en bedre pris: [email protected])

AX Semiconductor har 558-10-352M26-001104 på lager for selger.
Frakt alternativer og shipping tid:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Betalingsalternativer:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

spesifikasjoner for 558-10-352M26-001104

Kvalitets garanti : 365 dagers garanti
Stock Resource : Franchise distributør / produsent Direct
Opprinnelsesland : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Delenummer : 558-10-352M26-001104
Produsent : Preci-Dip
Beskrivelse : BGA SURFACE MOUNT 1.27MM
Serie : 558
Delstatus : Active
Type : BGA
Antall posisjoner eller pins (rutenett) : 352 (26 x 26)
Pitch - Parring : 0.050" (1.27mm)
Kontaktfinish - parring : Gold
Kontaktfinish tykkelse - parring : 10.0µin (0.25µm)
Kontaktmateriale - parring : Brass
Monteringstype : Surface Mount
Egenskaper : Closed Frame
Avslutning : Solder
Pitch - Post : 0.050" (1.27mm)
Kontakt Finish - Post : Gold
Kontakt ferdig tykkelse - post : 10.0µin (0.25µm)
Kontaktmateriell - Innlegg : Brass
Husmateriell : FR4 Epoxy Glass
Driftstemperatur : -55°C ~ 125°C
Vekt : -
Betingelse : Nytt og originalt
Relaterte linker : 558-10 , 558-10-352

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