BDN11-3CB/A01 - HEATSINK CPU W/ADHESIVE 1.11SQ

Produsentens varenummer

BDN11-3CB/A01

Intern delenummer

AX-BDN11-3CB/A01

Produsent

CTS Thermal Management Products

Kort beskrivelse

HEATSINK CPU W/ADHESIVE 1.11SQ

RoHS Status

Blyfri / RoHS

Leveringstid

1-2 dager

tilgjengelig Antall

170655 Pieces

Reference Pris

~~USD 1.644~~

Vår pris

- (Ta kontakt med oss for en bedre pris: [email protected])

AX Semiconductor har BDN11-3CB/A01 på lager for selger.

Frakt alternativer og shipping tid:: DHL: 2-3 days.; FEDEX: 2-3 days.; UPS: 2-4 days.; TNT: 3-5 days.; EMS: 5-8 days.; Normal Post: 10-15 days.

Betalingsalternativer:: Paypal (Credit Card); Bank Transfer (Wire Transfer); Western Union; MoneyGram

spesifikasjoner for BDN11-3CB/A01

Kvalitets garanti : 365 dagers garanti

Stock Resource : Franchise distributør / produsent Direct

Opprinnelsesland : USA / TAIWAN / MEXICO / MALAYSIA / PHI

Delenummer : BDN11-3CB/A01

Produsent : CTS Thermal Management Products

Beskrivelse : HEATSINK CPU W/ADHESIVE 1.11SQ

Serie : BDN

Delstatus : Active

Type : Top Mount

Pakken avkjølt : Assorted (BGA, LGA, CPU, ASIC...)

Vedleggsmetode : Thermal Tape, Adhesive (Included)

Form : Square, Pin Fins

Lengde : 1.110" (28.19mm)

Bredde : 1.110" (28.19mm)

Diameter : -

Height Off Base (Height of Fin) : 0.355" (9.02mm)

Effektdissipasjon @ temperaturstigning : -

Termisk motstand @ tvungen luftstrøm : 7.20°C/W @ 400 LFM

Termisk motstand @ Natural : 20.90°C/W

Materiale : Aluminum

Materiell finish : Black Anodized

Vekt : -

Betingelse : Nytt og originalt

Relaterte linker : BDN1 , BDN11-

dokumenter for BDN11-3CB/A01

Dataark : BDN11-3CB/A01.pdf

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