HTSS-115-02-SS-D-01 - HIGH TEMP SHROUDED .100 TERMINAL

Produsentens varenummer
Intern delenummer
Produsent
Kort beskrivelse
HIGH TEMP SHROUDED .100 TERMINAL
RoHS Status
Blyfri / RoHS
Leveringstid
1-2 dager
tilgjengelig Antall
101650 Pieces
Reference Pris
USD 2.76
Vår pris
- (Ta kontakt med oss ​​for en bedre pris: [email protected])

AX Semiconductor har HTSS-115-02-SS-D-01 på lager for selger.
Frakt alternativer og shipping tid:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Betalingsalternativer:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

spesifikasjoner for HTSS-115-02-SS-D-01

Kvalitets garanti : 365 dagers garanti
Stock Resource : Franchise distributør / produsent Direct
Opprinnelsesland : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Delenummer : HTSS-115-02-SS-D-01
Produsent : Samtec Inc.
Beskrivelse : HIGH TEMP SHROUDED .100 TERMINAL
Serie : Flex Stack, HTSS
Delstatus : Active
Koblingstype : Header
Kontakttype : Male Pin
Pitch - Parring : 0.100" (2.54mm)
Antall stillinger : 30
Antall rader : 2
Radavstand - parring : 0.100" (2.54mm)
Antall stillinger som er lastet : 29
Stil : Board to Board or Cable
shrouding : Shrouded - 4 Wall
Monteringstype : Through Hole
Avslutning : Solder
Festetype : Push-Pull
Kontaktlengde - parring : 0.250" (6.35mm)
Kontaktlengde - Innlegg : 0.165" (4.19mm)
Generell kontaktlengde : 0.530" (13.46mm)
Isolasjonshøyde : 0.350" (8.89mm)
Kontakt Shape : Square
Kontaktfinish - parring : Gold
Kontaktfinish tykkelse - parring : 30.0µin (0.76µm)
Kontakt Finish - Post : Tin
Kontaktmateriell : Phosphor Bronze
Isolasjonsmateriale : Liquid Crystal Polymer (LCP)
Egenskaper : Keying Slot
Driftstemperatur : -55°C ~ 125°C
Ingress Protection : -
Materialbrennbarhetsvurdering : UL94 V-0
Isolasjonsfarge : Natural
Nåværende vurdering : -
Spenningsvurdering : -
Vekt : -
Betingelse : Nytt og originalt
Relaterte linker : HTSS-1 , HTSS-115-

dokumenter for HTSS-115-02-SS-D-01

Relaterte produkter HTSS-115-02-SS-D-01 Samtec Inc.

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