TSM-103-02-S-DH-003-K-TR - CONN HEADER SMD R/A 6POS 2.54MM

Produsentens varenummer
Intern delenummer
Produsent
Kort beskrivelse
CONN HEADER SMD R/A 6POS 2.54MM
RoHS Status
Blyfri / RoHS
Leveringstid
1-2 dager
tilgjengelig Antall
286200 Pieces
Reference Pris
USD 0.980304
Vår pris
- (Ta kontakt med oss ​​for en bedre pris: [email protected])

AX Semiconductor har TSM-103-02-S-DH-003-K-TR på lager for selger.
Frakt alternativer og shipping tid:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Betalingsalternativer:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

spesifikasjoner for TSM-103-02-S-DH-003-K-TR

Kvalitets garanti : 365 dagers garanti
Stock Resource : Franchise distributør / produsent Direct
Opprinnelsesland : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Delenummer : TSM-103-02-S-DH-003-K-TR
Produsent : Samtec Inc.
Beskrivelse : CONN HEADER SMD R/A 6POS 2.54MM
Serie : TSM
Delstatus : Active
Koblingstype : Header
Kontakttype : Male Pin
Pitch - Parring : 0.100" (2.54mm)
Antall stillinger : 6
Antall rader : 2
Radavstand - parring : 0.100" (2.54mm)
Antall stillinger som er lastet : 5
Stil : Board to Board or Cable
shrouding : Unshrouded
Monteringstype : Surface Mount, Right Angle
Avslutning : Solder
Festetype : Push-Pull
Kontaktlengde - parring : 0.320" (8.13mm)
Kontaktlengde - Innlegg : -
Generell kontaktlengde : -
Isolasjonshøyde : 0.240" (6.10mm)
Kontakt Shape : Square
Kontaktfinish - parring : Gold
Kontaktfinish tykkelse - parring : 30.0µin (0.76µm)
Kontakt Finish - Post : Tin
Kontaktmateriell : Phosphor Bronze
Isolasjonsmateriale : Liquid Crystal Polymer (LCP)
Egenskaper : Pick and Place
Driftstemperatur : -55°C ~ 125°C
Ingress Protection : -
Materialbrennbarhetsvurdering : UL94 V-0
Isolasjonsfarge : Black
Nåværende vurdering : -
Spenningsvurdering : -
Vekt : -
Betingelse : Nytt og originalt
Relaterte linker : TSM-103- , TSM-103-02-S

dokumenter for TSM-103-02-S-DH-003-K-TR

Relaterte produkter TSM-103-02-S-DH-003-K-TR Samtec Inc.

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