BGM13HBA9E6327XTSA1 - MULTI CHIP MODULES

Produsentens varenummer

BGM13HBA9E6327XTSA1

Intern delenummer

AX-BGM13HBA9E6327XTSA1

Produsent

Infineon Technologies

Kort beskrivelse

MULTI CHIP MODULES

RoHS Status

Blyfri / RoHS

Leveringstid

1-2 dager

tilgjengelig Antall

1607330 Pieces

Reference Pris

~~USD 0.174552~~

Vår pris

- (Ta kontakt med oss for en bedre pris: [email protected])

AX Semiconductor har BGM13HBA9E6327XTSA1 på lager for selger.

Frakt alternativer og shipping tid:: DHL: 2-3 days.; FEDEX: 2-3 days.; UPS: 2-4 days.; TNT: 3-5 days.; EMS: 5-8 days.; Normal Post: 10-15 days.

Betalingsalternativer:: Paypal (Credit Card); Bank Transfer (Wire Transfer); Western Union; MoneyGram

spesifikasjoner for BGM13HBA9E6327XTSA1

Kvalitets garanti : 365 dagers garanti

Stock Resource : Franchise distributør / produsent Direct

Opprinnelsesland : USA / TAIWAN / MEXICO / MALAYSIA / PHI

Delenummer : BGM13HBA9E6327XTSA1

Produsent : Infineon Technologies

Beskrivelse : MULTI CHIP MODULES

Serie : -

Delstatus : Active

RF-familie / standard : Bluetooth

protokoll : 802.11a/b/g/n, Bluetooth v4.0

modulation : 16QAM, 64QAM, 256QAM, DSSS, FHSS, OFDM

Frekvens : 1.805GHz ~ 2.69GHz

Datahastighet : 54Mbps

Strøm - utgang : -

Følsomhet : -

Serielle grensesnitt : SPI, USB

Antenntype : -

Utnyttet IC / del : -

Minnestørrelse : -

Spenning - forsyning : 1.6V ~ 3.1V

Nåværende - mottak : -

Nåværende - overføring : -

Monteringstype : Surface Mount

Driftstemperatur : -40°C ~ 85°C

Pakke / sak : -

Vekt : -

Betingelse : Nytt og originalt

Relaterte linker : BGM13H , BGM13HBA9

dokumenter for BGM13HBA9E6327XTSA1

Dataark : BGM13HBA9E6327XTSA1.pdf

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